DARPA Issues Solicitations for High Density Connectorized Cryogenic Cables Project
(MilitaryAerospace) U.S. military researchers are asking industry to determine the feasibility of developing high-density connectorized cryogenic cables for future use in superconducting classical computing, superconducting quantum computing and quantum annealing, and superconducting single-photon detector arrays.
Officials of the U.S. Defense Advanced Research Projects Agency (DARPA) in Arlington, Va., have issued a solicitation recently for the High Density Connectorized Cryogenic Cables project.
Cryogenic cables are for use in low temperatures, and are made of low-thermal-conductivity metal materials on center and outer conductors, which minimize affect of low temperatures from outside the cables.
In the program’s first phase companies will compete for six-month worth as much as $175,000. Companies selected will be asked to submit phase-two proposals by invitation. The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR).
Companies interested should submit proposals no longer than 20 pages to the U.S. Department of Defense SBIR/STTR Proposal Submission website no later than 28 Sept. 2021 at https://www.sbir.gov/content/submission-proposals.
Email questions or concerns to DARPA at HR001121S0007@darpa.mil. More information is online at https://sam.gov/opp/7fe6084a108c40ec872366829ef550cc/view.
The goal is to create a new type of high-density data cable for superconducting electronics applications with high density, low attenuation, low crosstalk, and low heat load.